Qianli Metal BGA Reballing Stencil Platform for iPhone X XS XS MAX 11 Pro Motherboard Middle Layer Planting Tin Solder Template

Qianli Metal BGA Reballing Stencil Platform for iPhone X XS XS MAX 11 Pro Motherboard Middle Layer Planting Tin Solder Template

US $25.98

Description:

Model Number: IP-01 IP-02
Particle Size: 1-10μm
Style: Qianli BGA Reballing Platform
Application: BGA Reballing for iPhone X/XS/XS MAX
Function: BGA Reballing for iPhone 11/11 Pro/11 Pro MAX

Don’t miss out! Qianli Metal BGA Reballing Stencil Platform for iPhone X XS XS MAX 11 Pro Motherboard Middle Layer Planting Tin Solder Template only US $37.11 US $25.98.